Design-for-assembly (DFA) and design-for-manufacture (DFM) techniques can be applied to products assembled manually or automatically or manufactured by specific techniques, such as machining, die ...

A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Exact part location and minimal clearances seem like the Holy Grail of precision mechanical systems. But insisting on the slimmest tolerances can make assembly and disassembly difficult. Assembly ...

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

Lean manufacturing seeks to make clear what adds value by reducing everything else. Lean is clearly not a fixed-point objective; accelerating global market competition demands operational flexibility ...

If you would like to learn more about the IAEA’s work, sign up for our weekly updates containing our most important news, multimedia and more. This publication draws on the work carried out during an ...

[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.