Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area ...

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the ...

Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...

Samsungâ s 128 Gbyte DDR4 DIMM internally uses a four-level silicon stack linked via through-silicon vias (TSVs). Stacking DRAM has been part of the high-bandwidth memory (HBM) systems found in ...

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...