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Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...

Material sciences researchers are often looking for ways to improve the strength and viability of materials for a wide range of industries, including the construction industry. The need for processes ...