NBC News

Microsemi Achieves Memory Packaging Technology "First" for Demanding Military System Applications with DDR3 SDRAM Device

June 23, 2011, 7:16 AM EDT / Source: GlobeNewswire IRVINE, Calif., June 23, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated ...
Digi Times

PBGA substrate shortage may disrupt SiS and VIA chipset shipments

Because supplies of plastic ball-grid array (PBGA) substrates will continue to be short of demand throughout the end of this year, Taiwan chipset makers Silicon Integrated Systems (SiS) and VIA ...
Digi Times

Prices for two- and four-layer PBGA substrates to grow 10-15% by early 2004

Prices for two-layer and four-layer PBGA (plastic ball-grid array) substrates are expected to grow 10-15% by early 2004 because of limited supply, according to sources. Save my User ID and Password ...
EDN

2Gb DDR SDRAM – organized as 32M x 64

White Electronic Designs announced a 2Gb DDR SDRAM, organized as 32M x 64, packaged in a 25 x 25mm, 625mm2, 219 plastic ball grid array (PBGA) and weighing 2.5 grams (typical). It is suitable for high ...
Yahoo Finance

Ball Grid Array (BGA) Packaging Market Poised for Robust Growth, Fuelled by Lead-Free Technologies, IoT Advancements, and the Shift to Miniaturized Electronic Devices, with an ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
Electronic Design

Improving IC Package Inspection

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...