Intel has released a new package for stacking memory chips that will let manufacturers put more memory into cell phones without increasing the size of the handsets. The new package, called the ...
South Korean electronics and semiconductor giant Samsung claimed a three-dimensional, stacked memory chip breakthrough this week with new technology that shrinks the space needed for stacked chip ...
During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...
Today’s sophisticated vehicles leverage embedded systems for everything from infotainment to powertrain management. Even low-end automobiles incorporate scores of electronic control units (ECUs). By ...
Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...
NEC Electronics with Elpida Memory and Oki Electric, has developed technology to allow cell phones and portable devices to have as much memory as a high-performance computer. Single Package Can House ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Today Micron is announcing its newest version of high-bandwidth memory (HBM) for AI accelerators and high-performance computing (HPC). The company had previously offered HBM2 modules, but its newest ...
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