Festo demonstrates a seamless flow of wafers picked, aligned and transported to wet chemistry or a vacuum-based process.

Nos. 3 and 2 on the list are welding (25.30%) and bending (28.51%), respectively. The fact that slightly more respondents said bending was their greatest automation need is significant.

Project delivers operational benefits as well, which enhance overall fabrication productivity Read more at The Business Times ...

Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...

Veeco Instruments Inc. and Axcelis Technologies Inc. have entered into a merger agreement that when combined will create the fourth largest U.S. wafer fabrication equipment supplier.

KAWASAKI, Japan--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power ...

Littelfuse LFUS announced today that it will buy a 200mm wafer fab in Dortmund, Germany from Elmos Semiconductor SE. The purchase is expected to close early in fiscal 2025. The total purchase price is ...

Littelfuse LFUS recently completed the acquisition of the 200mm wafer fab in Dortmund, Germany, from Elmos Semiconductor SE, a move set to become effective on Dec. 31, 2024. The acquisition aligns ...