Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

At its annual SNUG Taiwan event this week, Synopsys Senior Vice President of IP Group John Koeter told DIGITIMES that if AI chip development were a baseball game, the ...

V-Chip, a subsidiary of Sai Microelectronic, has established a new IC design facility in Penang in September 2025.

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...