The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Deloitte warns trade restrictions and export controls are creating semiconductor chokepoints that could reshape AI chip ...

By Milana Vinn and Amy-Jo Crowley NEW YORK/ LONDON, March 12 (Reuters) - BE Semiconductor Industries has been fielding takeover interest, as demand for its chip-packaging technology has become more ...

By Milana Vinn and Amy-Jo Crowley NEW YORK/LONDON, March 13 (Reuters) - BE Semiconductor Industries has attracted takeover ...

ASML (ASML) shipped its first advanced packaging lithography system in late 2025 to expand beyond EUV. Taiwan Semiconductor holds over 50% of the high-end CoWoS advanced packaging market for AI chips.

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

ASML (ASML) plans to expand its chipmaking equipment portfolio with new products to capture more of the growing market for AI ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is ...

The transaction, backed by Pritzker Private Capital, brings together two of North America’s largest flexible packaging ...