The technology is what is known as five-dimensional (5)D optical storage and it is one the University of Southampton team has been pursuing for a while. It was first demonstrated back in 2013, with ...
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'Eternal' 5D memory crystal capable of storing 360 TB of data for billions of years now holds a full human genome
In 2016, progress was made in data storage development as scientists at the University of Southampton successfully developed a 5D memory crystal capable of storing up to 360 terabytes (TB) of data, ...
University of Southampton scientists have stored the full human genome on a 5D memory crystal—a revolutionary data storage format that can survive for billions of years. The team hope that the crystal ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
LOS ANGELES, May 19, 2020 /PRNewswire-PRWeb/ -- MedTech Breakthrough, an independent market intelligence organization that recognizes the top technology product companies in the global health and ...
Glass nanostructures etched using high-intensity femtosecond laser pulses promise to keep vast quantities of data safe for billions of years, describe Peter Kazansky, Ausra Cerkauskaite and Rokas ...
Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...
Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
LAS VEGAS--(BUSINESS WIRE)--VeriSilicon (688521.SH) today announced that QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem ...
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller ...
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC Technology
MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...
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